학술논문
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity
이용수 2
- 영문명
- Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity
- 발행기관
- 한국마이크로전자및패키징학회
- 저자명
- 간행물 정보
- 『마이크로전자 및 패키징학회지』제12권 제1호, 9~16쪽, 전체 8쪽
- 주제분류
- 공학 > 산업공학
- 파일형태
- 발행일자
- 2005.03.31
4,000원
구매일시로부터 72시간 이내에 다운로드 가능합니다.
이 학술논문 정보는 (주)교보문고와 각 발행기관 사이에 저작물 이용 계약이 체결된 것으로, 교보문고를 통해 제공되고 있습니다.
국문 초록
영문 초록
This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m·K thermal conductivity using the formulation incorporating 5 μm Ni and 0.2μm SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.
목차
1. Introduction
2. Experiment
3. Results and Discussion
4. Conclusion
Acknowledgement
References
해당간행물 수록 논문
- 전기화학적 환원 분석을 통한 무연 솔더 합금의 산화에 대한 연구
- 계면 화학반응과 무전해 니켈 금속층에서 나타나는 취성파괴와의 연관성에 관한 연구
- 고집적용 구리배선의 electromigration 및 thermal fatigue 연구
- 펄스 레이저 증착법을 이용한 Zn₁₋ₓMgₓO 박막의 제작과 특성연구
- Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity
- Quasi-static Analysis on the Effect of the Finite Metal with the Anisotropic Grooved Dielectric in Microstrip Lines
- 박막저항기 특성에 미치는 제조 공정 인자의 영향
- Ti/Cu/Au UBM의 Au 두께와 리플로우 온도에 따른 Sn-52In 솔더와의 계면반응 및 전단 에너지
- Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
- Interfacial Electrical/Dielectric Characterization in Low Temperature Polycrystalline Si
- Technology Computer-Aided Design과 결합된 SPICE를 통한 금속-강유전체-반도체 전계효과 트랜지스터의 전기적 특성 해석
- Tin Pest 방지 솔더합금의 크리프 특성
- Preparation of Field Effect Transistor with (Bi,La)Ti₃O₁₂ Gate Film on Y₂O₃/Si Substrate
- Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
참고문헌
교보eBook 첫 방문을 환영 합니다!
신규가입 혜택 지급이 완료 되었습니다.
바로 사용 가능한 교보e캐시 1,000원 (유효기간 7일)
지금 바로 교보eBook의 다양한 콘텐츠를 이용해 보세요!