무연솔더의 솔더링성 연구

• 영문명: A Study of Solderability of Lead-Free Solder
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 최병강(Byong-Kang Choi) 이상희(Sang-Hee Lee)
• 간행물 정보: 『산업기술연구논문지』산업기술교육훈련논문지 제16권 4호, 257~261쪽, 전체 5쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2011.12.30

영문 초록

As environmental concerns increasing, the electronics industry is focusing more attention on the lead free solder alternatives. However, the higher melting temperature of lead-free solder was likely to have problems which existing soldering equipment was being constrained. The feasibility of lead-free solder was investigated by addition of the Sn-In-Bi alloy with intermediate melting point. the melting temperature and the wetability of the Sn-In-Bi alloy compared to that of Sn-Pb and Sn-Ag solder. It was found that the zero -cross-time and wetting time of Sn-10In- 5Bi solder was similar to there of Sn-37Pb solder and was increased slightly than those of Sn-3.5Ag solder.

목차

Ⅰ. 서 론

Ⅱ. 실험방법 및 분석

Ⅲ. 실험결과 및 고찰

Ⅳ. 결 론

키워드

Lead-Free Solder(무연솔더) Sn-Pb Solder(주석-납 솔더) Melting Point(용융점) Zero-Cross-Time(영점시간) Sn-3.5Ag Solder(주석-은 솔더)