플렉서블 기반 미세 무연솔더 범프를 이용한 칩 접합 공정 기술

• 영문명: The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제3호, 15~20쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.09.30

영문 초록

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

목차

1. 서론

2. 관련 기술 산업의 동향

3. 실험내용

4. 결론

참고문헌

키워드

flexible bendable wearable flexible substrate Cu pillar bump Sn-Bi solder bump