전력반도체 접합용 천이액상확산접합 기술

• 영문명: Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제25권 제4호, 9~15쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2018.12.31

영문 초록

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

목차

1. 서론

2. 전력반도체 패키징의 신뢰성 이슈

3. TLP 접합의 원리

4. TLP 접합의 종류

5. 최신 천이액상확산접합 기술

6. 결론

감사의 글

References

키워드

Transient liquid phase bonding Power module High temperature SiC Solder