글로벌 배선 적용을 위한 UV 패턴성과 UV 경화성을 가진 폴리실록산

• 영문명: Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제25권 제4호, 1~7쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2018.12.31

영문 초록

As the performance and density of IC (integrated circuit) devices increase, power and signal integrities in the global interconnects of advanced packaging technologies are becoming more difficult. Thus, the global interconnect technologies should be designed to accommodate increased input/output (I/O) counts, improved power grid network integrity, reduced RC delay, and improved electrical crosstalk stability. This requirement resulted in the fine-pitch interconnects with a low-k dielectric in 3D packaging or wafer level packaging structure. This paper reviews an organic-inorganic hybrid material as a potential dielectric candidate for the global interconnects. An organic-inorganic hybrid material called polysiloxane can provide spin process without high temperature curing, an excellent dielectric constant, and good mechanical properties.

목차

1. 서론

2. 유무기 하이브리드 소재

3. 폴리실록산(polysiloxane)

4. 결론

감사의 글

References

키워드

Dielectric PSSQ Global Interconnect UV Curing Metallization