스트라이크 은도금의 조성 및 조건에 관한 연구

• 영문명: A Study on the Condition of Silver Strike Plating and the Composition of Plating Solution
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 김형성(Hyung Sung Kim)
• 간행물 정보: 『산업기술연구논문지』산업기술교육훈련논문지 제15권 4호, 131~142쪽, 전체 12쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2010.12.30

영문 초록

The Silver strike plating is essential in order to improve the adhesion, gloss and corrosion resistance of deposition layer and to prevent the mutual diffusion between deposition layer and base metal. The metal oxide layer should be removed in order to improve the solderability, which can accomplished by electrical reduction. The silver strike plating is the process in which a layer of silver is deposited on the layer of copper strike plated or nickel strike plated. Among these kinds of strike plating, the Ag-Cu alloy plating promote the adhesion of deposition layer and make it have a high corrosion resistance. However, the study on the complexing agent which reduce the potential difference of Ag and Cu. In this study, the deposition amount of Ag and chemical composition of the plated layer was investigated at various conditions of low current strike plating which use the CN-complexing agent and Ag-Cu plating solution.

목차

ABSTRACT

Ⅰ. 서론

Ⅱ. 실험방법

Ⅲ. 실험 및 결과분석

Ⅳ. 결론

참고문헌

키워드

스트라이크 시안화은칼리 중량퍼센트 원자퍼센트 은양극 납양극 Strike KAg(CN)2 Weight% Atomic% Ag plate Pt plate