Effects of Nano-sized Diamond on Wettability and Interfacial Reaction for Immersion Sn Plating

• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제17권 제3호, 59~63쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2010.09.30

영문 초록

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound (Cu₆Sn₅) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

목차

1. Introduction

2. Experimental Procedure

3. Results and Discussion

4. Conclusion

References

키워드

immersion Sn plating nano-sized diamond soldering interfacial reaction intermetallic compound (IMC)