플립칩 패키지 BGA의 전단강도 시험법 표준화

• 영문명: Regulation in Shear Test Method for BGA of Flip-chip Packages
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제17권 제3호, 1~9쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2010.09.30

영문 초록

We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.

목차

1. 서론

2. 전단속도에 따른 전단강도의 영향

3. 전단높이에 따른 전단강도의 영향

4. 요약

감사의 글

참고문헌