파워디바이스 패키징의 열제어 기술과 연구 동

• 영문명: Overview on Thermal Management Technology for High Power Device Packaging
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제21권 제2호, 13~21쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2014.06.30

영문 초록

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

목차

1. 서론

2. 파워디바이스 패키징 기술

3. 파워디바이스 패키지의 신뢰성 평가

4. 결론

References

키워드

Power device packaging Power electronics Interconnection Thermal interface materials Thermal management