Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use

• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제26권 제2호, 23~29쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2019.06.30

영문 초록

Thermally expandable microsphere and aerogel composite was prepared by chemical compositization. Microsphere can produce synergies with aerogel, especially an enhancement of mechanical property. Through condensation between sulfonated microsphere and hydrolyzed silica sol, chemically-connected composite aerogel could be prepared. The presence of hydroxyl group on the sulfonated microsphere was observed, which was the prime functional group of reaction with hydrolyzed silica sol. Silica aerogel-coated microsphere was confirmed through microstructure analysis. The presence of silicon-carbon absorption band and peaks from composite aerogel was observed, which proved the chemical bonding between them. A relatively low thermal conductivity value of $0.063W/m{\cdot}K$ 수식 이미지 was obtained.

목차

1. Introduction

2. Experimental

3. Results and Discussion

4. Conclusion

Acknowledgement

References

키워드

Thermally expandable microsphere aerogel organic-inorganic composites insulator