Sn-In-Bi계 무연솔더의 특성에 관한 연구

• 영문명: A Study of Characterization on the Property in Pb-free Solders of Sn-In-Bi
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 이상희(Sang-Hee Lee)
• 간행물 정보: 『산업기술연구논문지』산업기술교육훈련논문지 제18권 4호, 111~115쪽, 전체 5쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2013.12.30

영문 초록

Effects of electronics industry has been made to minimize the use of Pb due to the environmental concerns, and the use of Pb-free solders is attempted. However, the melting temperature of lead-free solder Sn-Pb solder process is likely to have problems than those. Existing soldering equipment used was being constrained. In this research, one way to resolve the problem by intermediate melting point alloy of Sn-In-Bi solder contained of the in acordance with the feasibility of lead-free solder were investigated. Sn-10In-5Bi solder were made has a melting temperature of 180∼196℃, wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-In-Bi alloy. Experimental results showed that the zero-cross-time and wetting time of Sn-10In-5Bi is comparable about Sn-37Pb. and a little better than these of Sn-3.5Ag solder.

목차

Ⅰ. 서 론

Ⅱ. 실험방법 및 분석

Ⅲ. 실험결과 및 고찰

Ⅳ. 결론

키워드

Lead-Free Solder 무연솔더 Sn-Pb Solder 주석-납 솔더 Melting Point 용융점 Zero-Cross-Time 영점시간 Sn-3.5Ag Solder(주석-은 솔더