신뢰도 분석 방법 및 운용환경 조건에 따른 회로카드조립체 고장율 변화

• 영문명: A study on Change of Failure rate for CCA by Reliability Analysis Methods and Operation Environment condition
• 발행기관: 한국산업경영시스템학회
• 저자명: 이승률(Seung-Ryool Lee) 박경덕(Kyoung-Deok Park) 전동주(Dong-Ju Jeon) 이수중(Su-Jung Lee)
• 간행물 정보: 『한국산업경영시스템학회 학술대회』2016년 추계학술대회 논문집, 1~6쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2016.10.30

영문 초록

When weapon system is designed and developed, a reliability is one of important factors to determine the development goal. The reliability analysis of the weapon system and equipment is based on MIL Specification, MIL-HDBK-217F and MIL-HDBK-338B. And the weapon system is operated on various environments by operating concept of the military using the weapon system. This study, at first, present failure rate by PSA comparing with failure rates by PCM, the different reliability analysis method, for same CCA(Circuit Card Assembly). And the study present change of reliability analysis results for CCA on various operation environment condition..

목차

1. 서론

2. 신뢰도 분석 방법에 따른 고장율 비교

3. 운용환경 조건에 따른 고장율 비교

4. 결론

키워드

Reliability analysis Failure rate Operation environment