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학술논문

Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity

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영문명
Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity
발행기관
한국마이크로전자및패키징학회
저자명
간행물 정보
『마이크로전자 및 패키징학회지』제12권 제3호, 267~274쪽, 전체 8쪽
주제분류
공학 > 산업공학
파일형태
PDF
발행일자
2005.09.30
4,000

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국문 초록

영문 초록

This paper presents the fabrication of surface acoustic wave (SAW)-based pressure sensor for long-term stable mechanical compression force measurement. SAW pressure sensor has many attractive features for practical pressure measurement: no battery requirement, wireless pressure detection especially at hazardous environments, and easy other functionality integrations such as temperature, humidity, and RFID. A 41° YX LiNbO₃ piezoelectric substrate was used because of its high SAW propagation velocity and large values of electromechanical coupling factors K². A silicon substrate with ~200μm deep cavity was bonded to the diaphragm with epoxy, in which gold was covered all over the inner cavity in order to confine electromagnetic energy inside the sensor, and provide good isolation of the device from its environment. The reflection coefficient S₁₁ was measured using network analyzer. High S/N ratio, sharp reflected peaks, and clear separation between the peaks were observed. As a mechanical compression force was applied to the diaphragm from top with extremely sharp object, the diaphragm was bended, resulting in the phase shifts of the reflected peaks. The phase shifts were modulated depending on the amount of applied mechanical compression force. The measured S₁₁ results showed a good agreement with simulated results obtained from equivalent admittance circuit modeling.

목차

1. Introduction
2. Design Parameters
3. Analysis Modeling and Computer Simulation
4. Fabrication
5. Results
6. Conclusions
Acknowledgment
References

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APA

. (2005).Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity. 마이크로전자 및 패키징학회지, 12 (3), 267-274

MLA

. "Improving Sensitivity of SAW-based Pressure Sensor with Metal Ground Shielding over Cavity." 마이크로전자 및 패키징학회지, 12.3(2005): 267-274

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