Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma Part I

• 영문명: Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma Part I
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제9권 제4호, 31~34쪽, 전체 4쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2002.12.31

영문 초록

For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using O₂, N₂, and CF_4 modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

목차

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2. 실험 방법

3. 결과 및 고찰

4. 결론

감사의 글

참고문헌

키워드

Molding Sticking Surface modification Plasma source ion implantation Adhesion