Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제22권 제1호, 35~41쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2015.03.31

영문 초록

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with 25-32μm diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

목차

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2. 실험 방법

3. 결과 및 고찰

4. 결론

감사의 글

References

키워드

Anisotropic conductive film (ACF) Ultrasonic bonding Solder ball FOB interconnection Reliability of electronic packaging