AD(Aerosol Deposition) 방법을 이용한 복합 삼투형 Al₂O₃-Ni 제조공정

• 영문명: Fabrication of Percolative Al₂O₃-Ni Composite Films Employing Aerosol Deposition
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 김강(Kang Kim) 박상열(Sang Youl Park)
• 간행물 정보: 『산업기술연구논문지』산업기술교육훈련논문지 제21권 2호, 7~13쪽, 전체 7쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2016.06.30

영문 초록

Recently, Smart-phone and Electric Devices are need to develop small-technical system. SOP(System on Package) are indispensible to the various Embedded capacitor in the one system package. In this study, Embedded capacitor was inserted in the PCB inner layers to effect PCB surfaces. The method was proved by Aerosol Deposition. Aerosol Deposition was made average 5μm Al₂O₃ composite films and accomplished dielectric constants by Ni-percolation. XRD and SEM proved existed Al₂O₃ and Ni in the composite layers. Ni was existed a little 0.0138~0.0781% by XRD. Al203 dielectric loss was zero by Ni quantity but characteristics of Al₂O₃ showed good devices states.

목차

Abstract

Ⅰ. 서론

Ⅱ. 본론

Ⅲ. 결론

참고문헌

키워드

패키지 장치 유전율 OP Dielectric