3차원 실장을 위한 TSV의 Cu 전해도금 및 로우알파 솔더 범핑

• 영문명: Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제22권 제4호, 7~14쪽, 전체 8쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2015.12.31

영문 초록

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

목차

1. 서론

2. TSV 형성과 기능 박막층 증착

3. TSV의 충전

4. TSV상의 로우 알파 솔더 범핑

5. 결론

감사의 글

References

키워드

three dimensional packaging TSV (Through Silicon Via) Cu filling low alpha solder bumping