학술논문
Adhesive Flip Chip Technology
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- 영문명
- CSP + HDI : MCM!
- 발행기관
- 한국마이크로전자및패키징학회
- 저자명
- 간행물 정보
- 『한국마이크로전자및패키징학회 학술대회자료집』2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging, 35~40쪽, 전체 6쪽
- 주제분류
- 공학 > 산업공학
- 파일형태
- 발행일자
- 2000.04.30
4,000원
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이 학술논문 정보는 (주)교보문고와 각 발행기관 사이에 저작물 이용 계약이 체결된 것으로, 교보문고를 통해 제공되고 있습니다.
국문 초록
영문 초록
목차
키워드
해당간행물 수록 논문
- LTCC Tape Characterization as Organic formulation
- Wire Bonding Technology for Recent Trend Packaging
- Adhesive Flip Chip Technology
- MultiChip Packaging for Mobile Telephony
- Wafer-Level CSP(Omega CSP)
- Lead Free Soldering Technology
- BGA to CSP to Flip Chip - Manufacturing Issues
- Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions
- High Density Processing for Flip Chip Package
- An Efficient Simultaneous Switching Noise Analysis of High Density Multi-layer Packages and PCBs
- Recent Trend in Japanese Packaging Technology
- Constrained sintering process for LTCC Fodel $^\circled1$ 수식 이미지 Process
- Electro Deposition on PCB Process
- Au-Au Flip Chip Mounting Technology by NEC
- A Wafer Level CSP Technology, Wafer Process Packaging-WPP
- Etching Characteristics of Fine Ta Patterns with Electron Cyclotron Resonance Chlorine Plasma
- Investigation of low cost flip chip under bump metallization (UBM) systems and non sonder bumps on Cu pads
- Flip Chip Interconnection Method Applied to Small Camera Module
- Reliable Anisotropic Conductive Adhesives Flip Chip on Organic Substrates For High Frequency Applications
- Fabrication of Micro-Crytallites by Heat Treatment and Nucleation by Laser Irradiation in Glass
- Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability
- Properties of Interlayer Low Dielectric Polyimide during Aluminum Etching with Electron Cyclotron Resonance Etcher System
- Package Design for Protecting Active Chip Surface from Damage due to a Dicing Saw Blade
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