학술논문
History and Current State of Ph-free Soldering Technology in Japan
이용수 0
- 영문명
- History and Current State of Ph-free Soldering Technology in Japan
- 발행기관
- 한국마이크로전자및패키징학회
- 저자명
- 간행물 정보
- 『한국마이크로전자및패키징학회 학술대회자료집』2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders, 27~40쪽, 전체 14쪽
- 주제분류
- 공학 > 산업공학
- 파일형태
- 발행일자
- 2004.09.30
4,360원
구매일시로부터 72시간 이내에 다운로드 가능합니다.
이 학술논문 정보는 (주)교보문고와 각 발행기관 사이에 저작물 이용 계약이 체결된 것으로, 교보문고를 통해 제공되고 있습니다.
국문 초록
영문 초록
목차
키워드
해당간행물 수록 논문
- Recent Progress in Pb-free Solders and Soldering Technology: Fundamentals, Reliability Issues and Applications
- Thermal Fatigue Life in and Flip Chip Solder Joints
- Review of Pb-free Activities in Taiwan
- New Generation of Lead Free Solder Spheres 'Landal - Seal'
- Development of FR-1 Materials for Lead-free Soldering
- Pb-free Status and Strategy of Semiconductor Business in Samsung Electronics
- Pre-applied Underfill Technology
- Solder Free Systems by ACI and NCP
- Formation Mechanisms of Various Solidification Defects in Lead-Free Soldering and Their Prevention
- History and Current State of Ph-free Soldering Technology in Japan
- Electrodeposited Tin Properties & Their Effect on Component Finish Reliability
- Lead-Free Solder Products and their Properties
- New Generation of Lead Free Paste Development
- Introduction to COST 531-A European Action on Lead-free Soldering
- Performance and Reliability Issues of Flip Chip Joints
- Practical Application of Lead-free Solder in Electronic Products
- Lead-free Implementation and Issues in Electronic Set Makers
- Assembly Technology Using Pb-free Solders: the State of the Art and Issues
참고문헌
교보eBook 첫 방문을 환영 합니다!
신규가입 혜택 지급이 완료 되었습니다.
바로 사용 가능한 교보e캐시 1,000원 (유효기간 7일)
지금 바로 교보eBook의 다양한 콘텐츠를 이용해 보세요!