테이블 이송속도 변화에 따른 세라믹 재료의 연삭특성에 관한 연구

• 영문명: A Study on the Grinding Characteristic of Ceramic Materials with Change Table Feed Speed
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 전은호(Eun Ho Jun)
• 간행물 정보: 『산업기술연구논문지』산업기술교육훈련논문지 제19권 3호, 243~249쪽, 전체 7쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2014.09.30

영문 초록

Silicon has been chiefly used to semiconductor industrial integration technology high functional, small light weight, high confidence and economics development a part, electronic products an industrial a ripple effect and change for saving resources, conserve energy, a technology intensive industry secure be located. Silicon with retain a property characteristics of thermal function, mechanical function, electromagnetic function, optical function, energy relation function and so extensive functions of create application expanding the new generation high technology industry a semiconductor equipment parts of one greatly in the sport lighted. Silicon is ceramics an identity mechanical characteristic have to high hardness and chipping. Lower the cost of production used to have been grinding application a diamond memorial stone. In this paper experimental results on the grinding characteristics of silicon are described The higher specific grinding energy and the better ground surface than conventional grinding.

목차

ᅵ. 서 론

II. 세라믹스 재료의 동향

III. 실험장치 및 방법

IV. 실험결과 및 고찰

V. 결 론

참고문헌

키워드

Grinding Characteristics(연삭특성) Table Feed Speed(테이블 이송속도) Depth Of Cut(절입깊이) Grinding Force(연삭저항력) Specific Grinding Anergy(비연삭 에너지)