실리콘 박막이 레이저 가공 시 발생하는 광기계적 손상 해석

• 영문명: Analysis of Photomechanical Damages in Laser Drilling of Thin Silicon Wafer
• 발행기관: 한국레이저가공학회
• 저자명: 오부국 김동식 김태현 전은숙 김남성
• 간행물 정보: 『한국레이저가공학회 학술대회 논문집』2008년도 추계학술발표대회 논문집, 34~39쪽, 전체 6쪽
• 주제분류: 공학 > 기계공학
• 파일형태: PDF
• 발행일자: 2008.11.30

영문 초록

Photomechanical damages of single-crystal silicon under 6 ns laser pulse (Nd:YAG) ablation at intensities of 1~20 GW/㎠ are studied through the scanning electron microscope investigation of the ablated samples and numerical simulations simultaneously. The effects of various parameters (beam size, irradiance, sample thickness, and crater shape) were investigated by using numerical model which is developed in this work considering the recoil pressure and the surface evaporation.

키워드

thin wafer silicon drilling photomechanical damage