CMP 슬러리의 최근 연구 동향: 슬러리 조성과 분석의 관점

• 영문명: Recent Advances in CMP Slurries: Composition and Analysis Perspectives
• 발행기관: 한국세라믹학회
• 저자명: 배기호(Kiho Bae) 임준환(Junhwan Yim) 이경태(Kyungtae Lee) 이강천(Kangchun Lee)
• 간행물 정보: 『세라미스트』제27권 제2호, 161~176쪽, 전체 16쪽
• 주제분류: 공학 > 화학공학
• 파일형태: PDF
• 발행일자: 2024.06.30

국문 초록

Chemical Mechanical Planarization (CMP) slurries play key role during planarization process in advanced semiconductor manufacturing, serving to planarize wafer surfaces and minimize unevenness in multi-layered device scheme. This paper provides a comprehensive review of the composition of CMP slurries and the analytical methods used to evaluate their components. The primary constituents of CMP slurries―abrasive particles, chemical agents, and various additives―are examined in detail, highlighting their roles and interactions. We report the latest research trends in CMP slurry composition and analytical methods, offering insights into future research directions and providing foundational information for optimizing CMP slurry performance. This, in turn, is expected to contribute to the ongoing advancement of the semiconductor industry and the fabrication of high-performance devices.

목차

1. 서론

2. 본론

3. 결론

ACKNOWLEDGEMENTS

REFERENCES

키워드

Chemical Mechanical Planarization(CMP) Slurry components Slurry characterization Colloid chemistry Semiconductor processing