Development of an Ultra-Slim System in Package (SiP)

• 영문명: Development of an Ultra-Slim System in Package (SiP)
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제15권 제1호, 7~18쪽, 전체 12쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2008.03.31

영문 초록

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

목차

1. Introduction

2. Manufacturing Processes

3. Thermo-mechanical Simulation

4. Reliability Evaluation

5. Discussion

6. Conclusion

References

키워드

RF Module SiP Flip chip Thermo-mechanical simulation Reliability test