銅 表面의 화학 腐蝕에 의한 蝕刻 패턴 연구

• 영문명: A Study on Etching Patterns of Copper Surface by Chemical Corrosion
• 발행기관: 강원대학교 산업기술연구소
• 저자명: 김민건(Kim Min Gun) 서봉원(Seo Bong Won)
• 간행물 정보: 『산업기술연구』vol.20, 1~10쪽, 전체 10쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2000.09.30

영문 초록

In order to observe the pattern forming of copper plate and chemical corrosion reaction, a study on the effect of the process parameters on the formation of micro-pattern by a photochemical etching of copper plate was carried out. The results are as follows : 1) Etching rate increases as the concentration of etchant increases under the regular condition of the temperature by the increasing of diffusion rate to surface. 2) Etching rate increases as the temperature of etchant increases by the fast acting of the material delivery of diffusion to surface under the regular condition of concentration. 3) It was found that etching speed increases as the material delivery of convection rising increased when the aeration speed of etchant increases. This result was from the fact acted by the material delivery of convection rising rather than material delivery of diffusion to the surface.

목차

Abstract

1. 서론

2. 배경

3. 실험재료 및 방법

4. 결과 및 고찰

5. 결론

참고문헌

키워드

식각액 확산속도 대류 물질전달 와류속도 Etchant Diffusion rate Convection Material delivery Aeration speed