Study of complex electrodeposited thin film with multi-layer graphene-coated metal nanoparticles

• 영문명: Study of complex electrodeposited thin film with multi-layer graphene-coated metal nanoparticles
• 발행기관: 한국탄소학회
• 저자명: Young-Lae Cho Jung-woo Lee Chan Park Young-il Song Su-Jeong Suh
• 간행물 정보: 『Carbon Letters』제21권, 68~73쪽, 전체 6쪽
• 주제분류: 자연과학 > 자연과학일반
• 파일형태: PDF
• 발행일자: 2017.01.01

영문 초록

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10？120 nm and quasispherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of 4.8 μm by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was 2.092 × 10？6 Ω·cm, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ~2.049 × 10？6 Ω·cm. The corrosion resistance of the BETF was 9.306 Ω, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

목차

1. Introduction

2. Experimental

3. Results and Discussion

4. Conclusions

References

키워드

complex electrodeposition metal nanoparticles multi-layer graphene-coated cu nanoparticles electrical wire explosion process corrosion resistance