응력 주입 층을 이용한 Kerf-less 웨이퍼링 기술 동향

• 발행기관: 한국세라믹학회
• 저자명: 양현석 엄누시아 김지원 임재홍
• 간행물 정보: 『세라미스트』제21권 제2호, 75~82쪽, 전체 8쪽
• 주제분류: 공학 > 화학공학
• 파일형태: PDF
• 발행일자: 2018.06.30

영문 초록

In the photovoltaics (PV) industry, there were many efforts to reduce the cost of production with high efficiency. The single most important cost factor in silicon technology is the wafer, accounting presently for ~35% of the module cost. it was already shown that the solar cell efficiency can be maintained up to the thickness range of 40-60μm. The direct production of ultra-thin silicon wafer is very attractive and numerous different techniques, such as electrochemical process, ion implantation, and epitaxial growth, have been proposed and developed in many academic and industrial laboratories.

목차

1. 서론

2. 본론

3. 결론

4. 감사의 글

참고문헌

키워드

Kerfless wafering technique photovoltaic