방열기판 전극형성 기술 동향

• 발행기관: 한국세라믹학회
• 저자명: 김단비 김지원 엄누시아 임재홍
• 간행물 정보: 『세라미스트』제21권 제2호, 83~88쪽, 전체 6쪽
• 주제분류: 공학 > 화학공학
• 파일형태: PDF
• 발행일자: 2018.06.30

영문 초록

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

목차

1. 서론

2. 본론

3. 결론

4. 감사의 글

참고문헌

키워드

Heat sink PVD Electroless plating SAM